Three dimensional Integrated Circuit Design Book

Three dimensional Integrated Circuit Design


  • Author : Vasilis F. Pavlidis
  • Publisher : Morgan Kaufmann
  • Release Date : 2010-07-28
  • Genre: Technology & Engineering
  • Pages : 336
  • ISBN 10 : 0080921868
  • Total Read : 76
  • File Size : 20,9 Mb

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Three dimensional Integrated Circuit Design Summary:

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. * Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers * The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find * Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D * Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

Three Dimensional Integrated Circuit Design Book

Three Dimensional Integrated Circuit Design


  • Author : Yuan Xie
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-12-02
  • Genre: Technology & Engineering
  • Pages : 284
  • ISBN 10 : 9781441907844
  • Total Read : 71
  • File Size : 8,8 Mb

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Three Dimensional Integrated Circuit Design Summary:

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Three Dimensional System Integration Book
Score: 5
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Three Dimensional System Integration


  • Author : Antonis Papanikolaou
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-12-07
  • Genre: Architecture
  • Pages : 246
  • ISBN 10 : 9781441909626
  • Total Read : 61
  • File Size : 7,8 Mb

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Three Dimensional System Integration Summary:

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Three Dimensional Integrated Circuit Layout Book

Three Dimensional Integrated Circuit Layout


  • Author : A. C. Harter
  • Publisher : Cambridge University Press
  • Release Date : 1991-11-28
  • Genre: Computers
  • Pages : 241
  • ISBN 10 : 9780521416306
  • Total Read : 79
  • File Size : 18,7 Mb

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Three Dimensional Integrated Circuit Layout Summary:

First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the traditional two-dimensional, circuits. The theory behind such circuits is presented in detail, together with experimental results.

3D Integration for NoC based SoC Architectures Book

3D Integration for NoC based SoC Architectures


  • Author : Abbas Sheibanyrad
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-11-08
  • Genre: Technology & Engineering
  • Pages : 278
  • ISBN 10 : 9781441976185
  • Total Read : 74
  • File Size : 9,5 Mb

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3D Integration for NoC based SoC Architectures Summary:

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Design of 3D Integrated Circuits and Systems Book

Design of 3D Integrated Circuits and Systems


  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release Date : 2018-09-03
  • Genre: Technology & Engineering
  • Pages : 328
  • ISBN 10 : 9781351831598
  • Total Read : 63
  • File Size : 10,9 Mb

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Design of 3D Integrated Circuits and Systems Summary:

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

3D Integration in VLSI Circuits Book

3D Integration in VLSI Circuits


  • Author : Katsuyuki Sakuma
  • Publisher : CRC Press
  • Release Date : 2018-04-17
  • Genre: Technology & Engineering
  • Pages : 219
  • ISBN 10 : 9781351779821
  • Total Read : 76
  • File Size : 9,7 Mb

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3D Integration in VLSI Circuits Summary:

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Machine Vision for Three Dimensional Scenes Book

Machine Vision for Three Dimensional Scenes


  • Author : Herbert Freeman
  • Publisher : Elsevier
  • Release Date : 2012-12-02
  • Genre: Technology & Engineering
  • Pages : 432
  • ISBN 10 : 9780323150637
  • Total Read : 98
  • File Size : 7,6 Mb

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Machine Vision for Three Dimensional Scenes Summary:

Machine Vision for Three-Dimensional Scenes contains the proceedings of the workshop "Machine Vision - Acquiring and Interpreting the 3D Scene" sponsored by the Center for Computer Aids for Industrial Productivity (CAIP) at Rutgers University and held in April 1989 in New Brunswick, New Jersey. The papers explore the applications of machine vision in image acquisition and 3D scene interpretation and cover topics such as segmentation of multi-sensor images; the placement of sensors to minimize occlusion; and the use of light striping to obtain range data. Comprised of 14 chapters, this book opens with a discussion on 3D object recognition and the problems that arise when dealing with large object databases, along with solutions to these problems. The reader is then introduced to the free-form surface matching problem and object recognition by constrained search. The following chapters address the problem of machine vision inspection, paying particular attention to the use of eye tracking to train a vision system; images of 3D scenes and the attendant problems of image understanding; the problem of object motion; and real-time range mapping. The final chapter assesses the relationship between the developing machine vision technology and the marketplace. This monograph will be of interest to practitioners in the fields of computer science and applied mathematics.