Advances in Chemical Mechanical Planarization  CMP  Book

Advances in Chemical Mechanical Planarization CMP


  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release Date : 2021-09-24
  • Genre: Technology & Engineering
  • Pages : 648
  • ISBN 10 : 9780128218198
  • Total Read : 84
  • File Size : 18,7 Mb

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Advances in Chemical Mechanical Planarization CMP Summary:

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in Chemical Mechanical Planarization  CMP  Book
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Advances in Chemical Mechanical Planarization CMP


  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release Date : 2016-01-09
  • Genre: Technology & Engineering
  • Pages : 536
  • ISBN 10 : 9780081002186
  • Total Read : 95
  • File Size : 8,9 Mb

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Advances in Chemical Mechanical Planarization CMP Summary:

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Advances in CMP Polishing Technologies Book

Advances in CMP Polishing Technologies


  • Author : Toshiro Doi
  • Publisher : William Andrew
  • Release Date : 2011-12-06
  • Genre: Science
  • Pages : 330
  • ISBN 10 : 9781437778595
  • Total Read : 97
  • File Size : 16,9 Mb

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Advances in CMP Polishing Technologies Summary:

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Chemical Mechanical Planarization of Microelectronic Materials Book

Chemical Mechanical Planarization of Microelectronic Materials


  • Author : Joseph M. Steigerwald
  • Publisher : John Wiley & Sons
  • Release Date : 2008-09-26
  • Genre: Science
  • Pages : 337
  • ISBN 10 : 9783527617753
  • Total Read : 67
  • File Size : 12,6 Mb

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Chemical Mechanical Planarization of Microelectronic Materials Summary:

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to

Abrasive Technology Book

Abrasive Technology


  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release Date : 2018-10-24
  • Genre: Technology & Engineering
  • Pages : 214
  • ISBN 10 : 9781789841930
  • Total Read : 94
  • File Size : 8,5 Mb

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Abrasive Technology Summary:

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Emerging Contaminants Book

Emerging Contaminants


  • Author : Aurel Nuro
  • Publisher : BoD – Books on Demand
  • Release Date : 2021-05-27
  • Genre: Science
  • Pages : 334
  • ISBN 10 : 9781839624186
  • Total Read : 76
  • File Size : 10,9 Mb

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Emerging Contaminants Summary:

Emerging Contaminants presents the reader with information on classification, recent studies, and adverse effects on the environment and human health of the main classes of contaminants. Emerging contaminants are synthetic or natural compounds and microorganisms produced and used by humans that cause adverse ecological and human health effects when they reach the environment. This book is organized into four sections that cover the classification of contaminants and the instrumental techniques used to quantify them, recent studies on pesticides, antibiotics as an important group of emerging contaminants, and studies of different classes of emerging contaminants such as polybrominated diphenyl ethers (PBDEs), microplastics, and others.

Chemical Mechanical Planarization of Semiconductor Materials Book

Chemical Mechanical Planarization of Semiconductor Materials


  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Release Date : 2004-01-26
  • Genre: Technology & Engineering
  • Pages : 444
  • ISBN 10 : 3540431810
  • Total Read : 59
  • File Size : 12,7 Mb

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Chemical Mechanical Planarization of Semiconductor Materials Summary:

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Wafer Manufacturing Book

Wafer Manufacturing


  • Author : Imin Kao
  • Publisher : John Wiley & Sons
  • Release Date : 2021-01-11
  • Genre: Technology & Engineering
  • Pages : 304
  • ISBN 10 : 9780470061213
  • Total Read : 87
  • File Size : 19,9 Mb

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Wafer Manufacturing Summary:

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.