Adhesion in Microelectronics Book

Adhesion in Microelectronics

  • Author : K. L. Mittal
  • Publisher : John Wiley & Sons
  • Release Date : 2014-08-25
  • Genre: Technology & Engineering
  • Pages : 368
  • ISBN 10 : 9781118831342
  • Total Read : 83
  • File Size : 14,7 Mb

Adhesion in Microelectronics Summary:

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Adhesion Measurement of Films   Coatings Book

Adhesion Measurement of Films Coatings

  • Author : K. L. Mittal
  • Publisher : VSP
  • Release Date : 2001
  • Genre: Technology & Engineering
  • Pages : 351
  • ISBN 10 : 9067643378
  • Total Read : 85
  • File Size : 17,6 Mb

Adhesion Measurement of Films Coatings Summary:

This book documents the proceedings of the Second International Symposium on Adhesion Measurement of Films and Coatings, held in Newark, NJ, October 25-27, 1999. Since the First Symposium (Boston 1992) there had been considerable activity in devising new, more reliable and more efficient ways to measure adhesion of films and coatings, which resulted in the decision to organize the Newark Symposium.Films and coatings are used for a variety of purposes – functional, decorative, protective, etc. – in a host of applications. Irrespective of the purpose or application of a film or a coating, their adequate adhesion to the underlying substrates is of paramount importance. Concomitantly, the need to develop techniques for quantitative assessment of adhesion of films and coatings is all too obvious.This volume contains a total of 20 papers, which have all been rigorously peer reviewed and suitably modified before inclusion. The topics include: measurement and analysis of interface adhesion; relative adhesion measurement for thin film structures; adhesion testing of hard coatings by a variety of techniques; challenges and new directions in scratch adhesion testing of coated substrates; application of scratch test to different films and coatings; evaluation of coating-substrate adhesion by indentation experiments; measurement of interfacial fracture energy in multifilm applications; laser induced decohesion spectroscopy (LIDS) for measuring adhesion; pulsed laser technique for assessment of adhesion; blade adhesion test; JKR adhesion test; coefficient of thermal expansion measurement; and residual stresses in diamond films.This volume, providing the latest information, will be of great value and interest to anyone working in the area of adhesion measurement of films and coatings.

Progress in Adhesion and Adhesives Book

Progress in Adhesion and Adhesives

  • Author : K. L. Mittal
  • Publisher : John Wiley & Sons
  • Release Date : 2017-06-15
  • Genre: Technology & Engineering
  • Pages : 464
  • ISBN 10 : 9781119407478
  • Total Read : 61
  • File Size : 7,5 Mb

Progress in Adhesion and Adhesives Summary:

With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.

Adhesion International 1993 Book

Adhesion International 1993

  • Author : Louis H. Sharpe
  • Publisher : CRC Press
  • Release Date : 1996-02-06
  • Genre: Technology & Engineering
  • Pages : 797
  • ISBN 10 : 2884491473
  • Total Read : 80
  • File Size : 5,6 Mb

Adhesion International 1993 Summary:

First published in 1996. ADHESION INTERNATIONAL 1993 is a volume of the Proceedings of the 16th Annual Meeting of The Adhesion Society, Inc. Williamsburg, Virginia, USA February 21-26,1993. This meeting featured an International Symposium on The Interphase.

Mechanics of Microelectronics Book

Mechanics of Microelectronics

  • Author : G.Q. Zhang
  • Publisher : Springer Science & Business Media
  • Release Date : 2006-08-25
  • Genre: Technology & Engineering
  • Pages : 566
  • ISBN 10 : 9781402049354
  • Total Read : 91
  • File Size : 19,7 Mb

Mechanics of Microelectronics Summary:

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Microelectronics Packaging Handbook Book

Microelectronics Packaging Handbook

  • Author : R.R. Tummala
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-11-27
  • Genre: Computers
  • Pages : 1030
  • ISBN 10 : 9781461560371
  • Total Read : 88
  • File Size : 17,8 Mb

Microelectronics Packaging Handbook Summary:

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Handbook of Wafer Bonding Book

Handbook of Wafer Bonding

  • Author : Peter Ramm
  • Publisher : John Wiley & Sons
  • Release Date : 2012-02-13
  • Genre: Science
  • Pages : 395
  • ISBN 10 : 9783527326464
  • Total Read : 70
  • File Size : 16,8 Mb

Handbook of Wafer Bonding Summary:

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Dielectric Films for Advanced Microelectronics Book

Dielectric Films for Advanced Microelectronics

  • Author : Mikhail Baklanov
  • Publisher : John Wiley & Sons
  • Release Date : 2007-04-04
  • Genre: Technology & Engineering
  • Pages : 508
  • ISBN 10 : 9780470065419
  • Total Read : 95
  • File Size : 10,6 Mb

Dielectric Films for Advanced Microelectronics Summary:

The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.