Adhesion in Microelectronics
- Author : K. L. Mittal
- Publisher : John Wiley & Sons
- Release Date : 2014-08-25
- Genre: Technology & Engineering
- Pages : 368
- ISBN 10 : 9781118831342
- Total Read : 69
- File Size : 14,5 Mb
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Adhesion in Microelectronics Summary:
This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings