Adhesion in Microelectronics Book

Adhesion in Microelectronics

  • Author : K. L. Mittal
  • Publisher : John Wiley & Sons
  • Release Date : 2014-08-25
  • Genre: Technology & Engineering
  • Pages : 368
  • ISBN 10 : 9781118831342
  • Total Read : 69
  • File Size : 14,5 Mb
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Adhesion in Microelectronics Summary:

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Adhesion Measurement of Films Coatings Book

Adhesion Measurement of Films Coatings

  • Author : K. L. Mittal
  • Publisher : VSP
  • Release Date : 2001
  • Genre: Technology & Engineering
  • Pages : 368
  • ISBN 10 : 9067643378
  • Total Read : 79
  • File Size : 15,6 Mb
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Adhesion Measurement of Films Coatings Summary:

This book documents the proceedings of the Second International Symposium on Adhesion Measurement of Films and Coatings, held in Newark, NJ, October 25-27, 1999. Since the First Symposium (Boston 1992) there had been considerable activity in devising new, more reliable and more efficient ways to measure adhesion of films and coatings, which resulted in the decision to organize the Newark Symposium.Films and coatings are used for a variety of purposes – functional, decorative, protective, etc. – in a host of applications. Irrespective of the purpose or application of a film or a coating, their adequate adhesion to the underlying substrates is of paramount importance. Concomitantly, the need to develop techniques for quantitative assessment of adhesion of films and coatings is all too obvious.This volume contains a total of 20 papers, which have all been rigorously peer reviewed and suitably modified before inclusion. The topics include: measurement and analysis of interface adhesion; relative adhesion measurement for thin film structures; adhesion testing of hard coatings by a variety of techniques; challenges and new directions in scratch adhesion testing of coated substrates; application of scratch test to different films and coatings; evaluation of coating-substrate adhesion by indentation experiments; measurement of interfacial fracture energy in multifilm applications; laser induced decohesion spectroscopy (LIDS) for measuring adhesion; pulsed laser technique for assessment of adhesion; blade adhesion test; JKR adhesion test; coefficient of thermal expansion measurement; and residual stresses in diamond films.This volume, providing the latest information, will be of great value and interest to anyone working in the area of adhesion measurement of films and coatings.

Progress in Adhesion and Adhesives Book

Progress in Adhesion and Adhesives

  • Author : K. L. Mittal
  • Publisher : John Wiley & Sons
  • Release Date : 2017-06-23
  • Genre: Technology & Engineering
  • Pages : 464
  • ISBN 10 : 9781119407515
  • Total Read : 64
  • File Size : 16,5 Mb
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Progress in Adhesion and Adhesives Summary:

With the ever-increasing amount of research being published it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in may subjects representing the field of adhesion science and adheisves. Based on the success and the warm reception accorded to the premier volume in this series “Progress in Adhesion and Adhesives” (containing the review articles published in Volume 2 (2014) of the journal Reviews of Adhesion and Adhesives (RAA)), volume 2 comprises 14 review articles published in Volume 4 (2016) of RAA. The subjects of these 14 reviews fall into the following general areas: 1. Surface modification of polymers for a variety of purposes. 2. Adhesion aspects in reinforced composites 3. Thin films/coatings and their adhesion measurement 4. Bioadhesion and bio-implants 5. Adhesives and adhesive joints 6. General adhesion aspects The topics covered include: surface modification of natural fibers for reinforced polymer composites; adhesion of submicrometer thin metals films; surface treatments to modulate bioadhesion; hot-melt adhesives from renewable resources; particulate-polymer composites; functionally graded adhesively bonded joints; fabrication of nano-biodevices; effects of particulates on contact angles , thermal stresses in adhesively bonded joints and ways to mitigate these; laser-assisted electroless metallization of polymer materials; adhesion measurement of coatings on biodevices/implants; cyanoacrylate adhesives; and adhesion of green flame retardant coatings onto polyolefins.

Moisture Sensitivity of Plastic Packages of IC Devices Book

Moisture Sensitivity of Plastic Packages of IC Devices

  • Author : X.J. Fan
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-07-23
  • Genre: Technology & Engineering
  • Pages : 558
  • ISBN 10 : 9781441957191
  • Total Read : 72
  • File Size : 20,9 Mb
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Moisture Sensitivity of Plastic Packages of IC Devices Summary:

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Mechanics of Microelectronics Book

Mechanics of Microelectronics

  • Author : G.Q. Zhang
  • Publisher : Springer Science & Business Media
  • Release Date : 2006-08-25
  • Genre: Technology & Engineering
  • Pages : 566
  • ISBN 10 : 9781402049354
  • Total Read : 73
  • File Size : 15,9 Mb
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Mechanics of Microelectronics Summary:

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Microelectronics Packaging Handbook Book

Microelectronics Packaging Handbook

  • Author : R.R. Tummala
  • Publisher : Springer Science & Business Media
  • Release Date : 2013-11-27
  • Genre: Computers
  • Pages : 1030
  • ISBN 10 : 9781461560371
  • Total Read : 89
  • File Size : 6,5 Mb
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Microelectronics Packaging Handbook Summary:

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Die Attach Materials for High Temperature Applications in Microelectronics Packaging Book

Die Attach Materials for High Temperature Applications in Microelectronics Packaging

  • Author : Kim S. Siow
  • Publisher : Springer
  • Release Date : 2019-01-29
  • Genre: Technology & Engineering
  • Pages : 279
  • ISBN 10 : 9783319992563
  • Total Read : 72
  • File Size : 20,5 Mb
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Die Attach Materials for High Temperature Applications in Microelectronics Packaging Summary:

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Reliability of Organic Compounds in Microelectronics and Optoelectronics Book

Reliability of Organic Compounds in Microelectronics and Optoelectronics

  • Author : Willem Dirk van Driel
  • Publisher : Springer Nature
  • Release Date : 2022
  • Genre: Electronic books
  • Pages : 552
  • ISBN 10 : 9783030815769
  • Total Read : 67
  • File Size : 11,9 Mb
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Reliability of Organic Compounds in Microelectronics and Optoelectronics Summary:

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems. Presents methodologies for analysing the reliability, failure, and degradation of different organic materials, used in optoelectronics and microelectronics; Provides an overview of different failure mechanisms in different organic materials; Explains how to correlate product performance and reliability to materials degradation; Provides an overview of simulation techniques and methodologies to predict lifetime and reliability of engineering materials and components; Integrates several degradation causes in different materials (thermal, moisture, light radiation, mechanical damage, and more) into large-scale system solutions in several industrial domains (lighting, automotive, oil/gas, and transport and more); Includes case studies from different failure/degradation mechanisms in different industrial sectors.